The Benefits of Using AD255C in RF and Microwave Printed Circuit Board
pcbhamal specialize in Printed Circuit Board manufacturing and assembly using premium RF materials like Rogers AD255C—a ceramic-filled PTFE laminate engineered for high-frequency performance. Whether you’re developing RF front-end modules, base station antennas, or satellite links, AD255C delivers the dielectric stability, low dissipation factor, and thermal reliability needed to maintain signal integrity at GHz-level frequencies.
Key Features of AD255C:
- Stable dielectric constant (Dk ≈ 2.55) across wide bandwidths
- Extremely low dissipation factor (Df ≈ 0.0013) at 10 GHz
- Excellent dimensional stability under thermal cycling
- Outstanding passive intermodulation (PIM) performance
- Compatible with mixed dielectric stackups and multilayer processing
Rogers AD Series Laminate Data Sheet (AD250C & AD255C)
| Properties | AD250C | AD255C | Units | Test Conditions | Test Method |
|---|---|---|---|---|---|
| Electrical Properties | |||||
| Dielectric Constant (process) | 2.52 | 2.55 | – | 23°C @ 50% RH, 10 GHz | IPC-TM-650 2.5.5.5 |
| Dielectric Constant (design) | 2.50 | 2.60 | – | C-24/23/50, 10 GHz | Microstrip Differential Phase Length |
| Dissipation Factor | 0.0013 | 0.0013 | – | 23°C @ 50% RH, 10 GHz | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of Dk | -117 | -110 | ppm/°C | 0 to 100°C, 10 GHz | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 4.8 × 10⁸ | 7.4 × 10⁸ | MΩ·cm | C96/35/90 | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.1 × 10⁷ | 3.6 × 10⁷ | MΩ | C96/35/90 | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 979 | 911 | V/mil | – | IPC-TM-650 2.5.6.2 |
| Dielectric Breakdown | >40 | >40 | kV | D-48/50, X/Y direction | IPC-TM-650 2.5.6 |
| PIM² | -159/-163 | -159/-163 | dBc | Reflected 43 dBm @ 1900 MHz, S1/S1 | Rogers Internal 50 ohm |
| Thermal Properties | |||||
| Decomposition Temperature (Td) | >500 | >500 | °C | 2hrs @ 105°C, 5% Weight Loss | IPC-TM-650 2.3.40 |
| CTE – X | 47 | 34 | ppm/°C | – | IPC-TM-650 2.4.41 |
| CTE – Y | 26 | 26 | ppm/°C | -55°C to 288°C | IPC-TM-650 2.4.41 |
| CTE – Z | 196 | 196 | ppm/°C | – | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 0.33 | 0.35 | W/m·K | z direction | ASTM D5470 |
| Time to Delamination | >60 | >60 | minutes | as-received @ 288°C | IPC-TM-650 2.4.24.1 |
| Mechanical Properties | |||||
| Copper Peel Strength | 2.6 (14.8) | 2.4 (13.6) | N/mm (lbs/in) | 10s @ 288°C / 35 µm foil | IPC-TM-650 2.4.8 |
| Flexural Strength (MD/CMD) | 60.7/44.1 (8.8/6.4) | 61.8/41.1 (8.4/6.0) | MPa (ksi) | 25°C ± 3°C | ASTM D790 |
| Tensile Strength (MD/CMD) | 41.4/38.6 (6.0/5.6) | 55.8/45.3 (8.1/6.6) | MPa (ksi) | 23°C @ 50% RH | ASTM D3039/D3039-14 |
| Flexural Modulus | 6102/5654 (885/821) | 6412/5640 (930/818) | MPa (ksi) | 25°C ± 3°C | IPC-TM-650 2.4.4 |
| Dimensional Stability (MD/CMD) | 0.02/0.06 | 0.03/0.07 | mils/inch | After etch & bake | IPC-TM-650 2.4.39a |
| Physical Properties | |||||
| Flammability | V-0 | V-0 | – | – | UL 94 |
| Moisture Absorption | 0.04 | 0.03 | % | E1/105 +D48/50 | IPC-TM-650 2.6.2.1 |
| Density | 2.28 | 2.28 | g/cm³ | C24/23/50 | ASTM D792 |
| Specific Heat Capacity | 0.813 | 0.813 | J/g·K | 2 hours @ 105°C | ASTM E2716 |
Notes:
- Typical values are a representation of an average value for the population of the property. For specification values contact Rogers Corp.
- PIM Performance is heavily influenced by the copper choice. PIM values provided are typical values based on testing of the S1 foil using Rogers’ internal test method on 0.030” thick and 0.060” thick laminates.
- Rogers recommends the customer evaluate each material and design combination to determine fitness for use over the entire life of the end product
- At Highleap Electronics, we help customers simulate, prototype, and mass-produce RF/microwave PCBs with genuine Rogers AD255C. From material sourcing to stackup design, impedance control, and assembly—we offer full technical support for your RF success.
Design & Manufacturing Guidelines for AD255C PCB Laminates
AD255C offers exceptional electrical and thermal performance, but to maximize its advantages in real-world designs, careful attention to processing is essential. Based on Rogers’ fabrication recommendations and our production expertise, here are a few best practices:
PCB Design Tips for AD255C:
- Use design Dk (2.55) for accurate impedance modeling
- Avoid aggressive mechanical brushing; use chemical cleaning methods
- Plasma treatment (CF4/O2) preferred before PTH for better adhesion
- Pre-bake cores at 110–125°C for 30 minutes before lamination
- Choose compatible bonding films (e.g., RO4400, FEP) for multilayers
- Avoid stacking more than 5 cartons of laminate during storage
- Always use high-quality, sharp carbide drill bits with controlled feed/speed
Our engineers can help evaluate stackup combinations and ensure DFM compatibility before production begins. Simply share your Gerber files or build spec with our team for a free review.
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